Thermal & Electron Beam Evaporation System
Fully automatic with manual override system for 2” to 12” wafer in a compact footprint. The Thermal & Electron Beam Evaporation System is designed for conformal and lift-off deposition process of thin film metal.
Inductively Coupled Plasma Etching System Nasca-20 Plus
- Anisotropic etching of silicon films for ULSI devices.
- Etching of metal films.
- Etching of GaAs, GaN, InP and other Compound semiconductor films.
- Silicon Deep etching (MEMS).
- Production of waveguide devices.
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