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Single Wafer Process Etching, PR Striping, Cleaning, Thin Film Deposition, Bonder, Debonder, Wafer Transfer Taping-Detaping & CMP
GPTC
Cello Technology
Dyna Tech
Logitech

Metrology & Inspection
Carl Zeiss
Oxford Instruments
AIT
Technos
Sentronics Metrology
Photonic Instruments
Logitech

FA & QRA Lab Solutions
Everbeing
I.H.S.
Struers (Philippines)

Specialty Materials Chemicals
Chemleader
Syst Integration
SPI Supplies

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 



Single Wafer Process Etching, PR Striping, Cleaning, Thin Film Deposition, Bonder, Debonder, Wafer Transfer Taping-Detaping & CMP



Cello Technology

Thermal & Electron Beam Evaporation System

Fully automatic with manual override system for 2” to 12” wafer in a compact footprint. The Thermal & Electron Beam Evaporation System is designed for conformal and lift-off deposition process of thin film metal.

 

 

Inductively Coupled Plasma Etching System Nasca-20 Plus

APPLICATIONS

  • Anisotropic etching of silicon films for ULSI devices.
  • Etching of metal films.
  • Etching of GaAs, GaN, InP and other Compound semiconductor films.
  • Silicon Deep etching (MEMS).
  • Production of waveguide devices.

 

For more information, please visit : www.cello-tech.com


 

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