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Single Wafer Process Etching, PR Striping, Cleaning, Thin Film Deposition, Bonder, Debonder, Wafer Transfer Taping-Detaping & CMP
GPTC
Cello Technology
Dyna Tech
Logitech

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Carl Zeiss
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Logitech

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Everbeing
I.H.S.
Struers (Philippines)

Specialty Materials Chemicals
Chemleader
Syst Integration
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Single Wafer Process Etching, PR Striping, Cleaning, Thin Film Deposition, Bonder, Debonder, Wafer Transfer Taping-Detaping & CMP



Dyna Tech

Dyna Tech Co.

  • Fully automatic wafer backgrind, mounting and de-tape system for 300mm ultra-thin wafer
  • Stand alone Mounter, Detaper, Laminator of BSP/LC Tape, DAF Tape, BG & Dry Film
  • UV irradiation, Manual Tape mount, De-tape, OCR Barcode print.
  • Wafer Transfer System, Debonder, Warpage Adjuster for eWLB process




 

For more information, please visit : www.dynatech.co.kr

 

 

 

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