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Single Wafer Process Etching, PR Striping, Cleaning, Thin Film Deposition, Bonder, Debonder, Wafer Transfer Taping-Detaping & CMP
GPTC
Cello Technology
Dyna Tech
Logitech

Metrology & Inspection
Carl Zeiss
Oxford Instruments
AIT
Technos
Sentronics Metrology
Photonic Instruments
Logitech

FA & QRA Lab Solutions
Everbeing
I.H.S.
Struers (Philippines)

Specialty Materials Chemicals
Chemleader
Syst Integration
SPI Supplies

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 



Single Wafer Process Etching, PR Striping, Cleaning, Thin Film Deposition, Bonder, Debonder, Wafer Transfer Taping-Detaping & CMP



Logitech

Tribo CMP System

Logitech’s CMP system offers nanometer level metarial removal capabilities on either
individual die or wafers up to 200mm diameter.

Specific application where the system can do:

  • Silicon wafer CMP
  • Global CMP of III-V Compound Semiconductor
  • Global CMP of brittle, friable IR material substrates
  • Global CMP of Sapphire, Gallium Nitride & Silicon Carbide substrates
  • Reclamation of EPI ready substrates
  • Final Stage thinning of SOS & SOI wafers to below 20 microns
  • Device delayering for reverse engineering of FA applications

 


 

Precision Lapping & Polishing System

  Wafer Substrate Bonding Unit


 

 

Akribis-air: Intelligent Sample Preparation System

  • Automatic wafer thickness control
  • Plate flatness control
  • Faster removal rates due to load and plate speed
  • Reduced waste through the metered abrasive feed supply
  • Real Time Data from in-situ bluetooth jig micrometer gauge
  • Reduced maintenance and clean-up using the auto wash feature

 

For more information, please visit : www.logitech.uk.com

 

 

 


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