Semiconductor Equipment & Materials
Wafer Fabrication – Thin Film and Advanced Packaging Process
Wafer Processing Systems
• Fully automatic wafer backgrind, mounting and de-tape system for 300mm ultra-thin wafer
• Stand alone Mounter, Detaper, Laminator of BSP/LC Tape, DAF Tape, BG & Dry Film
• UV irradiation, Manual Tape mount, De-tape, OCR Barcode print
• Wafer Transfer System, Debonder, Warpage Adjuster for eWLB process
For more information, please visit www.dynatech.co.kr.