Semiconductor Equipment & Materials

QRA & Materialographic Preparation

PM6

The PM6 machine is used extensively in the preparation of:
• Geological Thin Sections: i.e. Rock lapping system
• Semiconductor Materials i.e. Polishing silicon wafers

Tribo CMP System

Logitech’s CMP system offers nanometer level material removal capabilities on either individual die or wafers up to 200mm diameter.

This system is particularly suitable for the following specific applications:
• Silicon wafer CMP to <1nm Ra
• Global CMP of III-V Compound Semiconductor
• Global CMP of brittle, friable IR material substrates
• Global CMP of Sapphire, Gallium Nitride & Silicon Carbide substrates
• Reclamation of EPI ready substrates
• Final Stage thinning of SOS & SOI wafers to below 20 microns
• Device delayering for reverse engineering of FA applications