Semiconductor Equipment & Materials

Wafer Fabrication – Thin Film and Advanced Packaging Process

Nasca-20 Plus, ICP-RIE

APPLICATIONS
• Anisotropic etching of silicon films for ULSI devices.
• Etching of metal films.
• Etching of GaAs, GaN, InP and other Compound semiconductor films.
• Silicon Deep etching (MEMS).
• Production of waveguide devices.

Ohmiker-30

Model Diamond Thermal and Electron Beam Evaporator, high-capacity manufacturing model

Fully automatic with manual override system for 2” to 12” wafer in a compact footprint. The Thermal & Electron Beam Evaporation System is designed for conformal and lift-off deposition process of thin film metal.

Sputter & ICP Equipment

Seker-90P: Optical Coater
Ohmiker-50SL: Sputter
Ohmiker-60B: Evaporator

Tacichi-306

Wafer Bonder