Semiconductor Equipment & Materials

Wafer Fabrication – Thin Film and Advanced Packaging Process

Front End Wet Process Technology

Batch Type Process Equipment

Batch type process for Dry Film strip, Photoresist Strip, Glass Slim/Etch, Wafer Clean, Electroplating ECD.

Frontend Wafer Fabrication Process Equipment

1. EUV Mask Clean
2. Prime Wafer Clean
3. Wafer Stress Release Etch

UFO-300

UFO-300 model is a Single Wafer Process system for 200 - 300mm wafers, and is capable of performing UBM Etch, Photoresist Strip, Wafer Clean/Scrub, Metal Lift-Off, PER Polymer Remover and Solder & Flux Clean.