Semiconductor Equipment & Materials

Specialty Materials

• RDL, Wafer Bump Process Specialty Etchants
Ti, TiW, Cu, Au, NiV, Si, Al, Ni, Cr, SiO2, Si3N4, Rework solutions

• Photoresist Strip or Polymer Removal Material
Positive & Negative Photoresist stripper, Thick Liquid and Dry Films stripper

• Gold Plating Solution
Non-cyanide gold solution, Reclaim service

• Photoresist Material
Positive and Negative. Application for FPD, LED and IC Fabrication.