Semiconductor Equipment & Materials

CMP and Slurry Materials

Boron Carbide
Green Silicon Carbide
• JIS240# - JIS6000#
• Provide abrasives, grinding tools, abrasives and manufacture other...

Wafer Cutting Fluid
• SWC-2500, SWC-6000
• Cutting fluid for diamond wire cutting can effectively extend the...

Diamond Scribing Knife
• CORE (Dia-Pen)
• Use a diamond scribing knife to scribble lines on the wafer...

CMP Slurry
• CMP60, CMP160, etc.
• It is made of nano-grade abrasive particles and a special substrate...

CMP Polishing Pad
• Provide a variety of surface options (such as flat, grid, etc.)

Precision Ceramic Plate
• CB240, CB260 (Customisable)
• The carrier for carrying workpieces is made of high-...

Diamond Repair Knife
• PST-PCD60° (Customisable)
• Made of carefully selected diamonds, used for polishing...

Polycrystalline Diamond Powder
• Provide customer particle size specifications according to customer needs
• Widely used in surface treatment of semiconductor materials...