What We Offer
Reliable Technology Solutions
Specialty Materials & Chemicals
Direct & Efficient Technical Support
Wide Industry & Market Coverage
Why Choose Us
What We Offer
News / Events
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SEMICON SINGAPORE 2025 - HEIDELBERG INSTRUMENTS JOINT WORKSHOP
Regional Business Network will be conducting a joint workshop with Heidelberg Instruments, focusing on Maskless Direct-Write Technologies for the Advanced Micro- and Nanofabrication.
Date: 16 May 2025
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SEMICON SINGAPORE 2025
We will be happy to meet all customers and interested parties during SEMICON SINGAPORE 2025.
Date: 20 - 22 May 2025
Venue: Sands Expo & Convention Centre, Hall E, Booth B1820
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Critical Support
In Many Industries
Many different industries leverage on our expertise in products and materials used in Wafer Fabrication & Packaging, Metrology & Inspection, and QRA & Materialographic Preparation.
SPI Supplies
MICA Sheet
The highest quality for thin film deposition, replication and AFM studies.
Dyna Tech Co. Ltd.
Wafer Processing Systems
• Fully automatic wafer backgrind, mounting and de-tape system for 300mm ultra-thin wafer • Stand alone Mounter, Detaper, Laminator of BSP/LC Tape, DAF Tape, BG & Dry Film • UV irradiation, Manual Tape mount, De-tape, OCR Barcode print • Wafer Transfer System, Debonder, Warpage Adjuster for eWLB process
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We Are Always Open
For Discussion & Support
We welcome discussion with new industries requiring our technical expertise, as well as offering continued technical support to all our customers.